Highlights
Task:
General Micro Electronics, Incorporated:
Semiconductor Assembly Process
Scott M. Shafer, Wake Forest University Charles Volk, Effective Business Solutions
GENERAL MICRO ELECTRONICS, INCORPORATED: SEMICONDICOR ASSEMBLY PROCESS
Having just left a tense meeting with Tom Kacy (her boss) and Charles Samuelson (Katy's boss). Brianna Regan, process engineer at General Micro Electronics (GME). was sitting in her office. She shifted her gaze from the data she was studying in the Excel spreadsheet to the sample semiconductor chips scaaetcd or: her desk. She tapped nervously with her pencil and stared at the chips. She was refiscing on what the data was saying and thinking about what her recommendations were going to be to turn around the performance of the new automated wire-bonder machine used in GME's assembly operation. The company had purchased the new machine and had it all set up by the begin-ning of January. It was now May. and Regan was Doming increasingly frustrated with her inability to get control owr the machine. She knew that if the new machine's performance continued to deteriorate, she would soon be getting the type of attention from senior management she %%add prefer to avoid. GME purchased the new witsbander machine in part to support the company's contract assembly business which was growing three times faster than the company's proprietary semiconductor business. From its initial installation in January through February, the new machine performed well in terms of the wire-bond strength. How-ever, beginning in March, its performance became more erratic, although still accept-able. By April. the machnit's performance had grown more and more erratic to the point that it was finally deemed unacceptable to the operations managers at GME. Regan herself was beco
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