General Micro Electronics, Incorporated: Semiconductor - Semiconductor Assembly Process - Engineering Assignment Help

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General Micro Electronics, Incorporated:
Semiconductor Assembly Process
Scott M. Shafer, Wake Forest University
Charles Volk, Effective Business Solutions

Copyright © 2012 by the Case Research Journal and by Scott M. Shafer and Charles Volk.In submitting this case to the Case Research Journal for widespread distribution in print and electronic media, I (we) certify that it is original work, based on real events in a real organization. It has not been published and is not under review elsewhere. Copyright holders have given written permission for the use of any material not permitted by the “Fair Use Doctrine.” The host organization has assigned a release authorizing the publication of all information gathered with understandings of confidentiality. The authors are grateful to Dr. Deborah Ettington, the editor of the Case Research Journal, and three anonymous reviewers who gave invaluable advice and suggestions for improving this case and to John

Waltman for his copy editing expertise. This case was developed for the sole purpose of providing mate-rial for course analysis and class discussion. It is not intended to illustrate either effective or ineffective handling of a managerial situation. All characters, data, and events are real, but names of people, organizations, and dates have been disguised.

General Micro Electronics, Incorporated: Semiconductor
Assembly Process
Having just left a tense meeting with Tom Kacy (her boss) and Charles Samuelson (Kacy’s boss), Brianna Regan, process engineer at General Micro Electronics (GME), was sitting in her office. She shifted her gaze from the data she was studying in the Excel spreadsheet to the sample semiconductor chips scattered on her desk. She tapped nervously with her pencil and stared at the chips. She was reflecting on what the data was saying and thinking about what her recommendations were going to be to turn around the performance of the new automated wire-bonder machine used in GME’s assembly operation.

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